company news about What are the factors that affect the performance of thermally conductive adhesive?

In the fields of new energy vehicles and semiconductors, thermally conductive adhesive is a key material for thermal management, and its performance is directly related to the heat dissipation efficiency and stability of the equipment. An in-depth analysis of the factors affecting the performance of thermally conductive adhesives is of great significance for optimizing product design and improving overall performance. Below, the editor will take you to learn more about the factors that affect the performance of thermally conductive adhesives.

1.Types and dosage of thermally conductive fillers

The type and amount of filler will affect the thermal conductivity of the adhesive. When there is less filler, the filler is completely wrapped by the matrix resin, and most of the filler particles are not in direct contact with each other. At this time, the adhesive matrix becomes a heat flow obstacle between the filler particles, inhibiting the transfer of filler phonons, so regardless of the addition No filler can significantly improve the thermal conductivity of the adhesive. As the amount of filler increases, the filler gradually forms a stable thermal conductivity network in the matrix. At this time, the thermal conductivity increases rapidly, and filling high thermal conductivity fillers is more conducive to improving the thermal conductivity of the adhesive. However, excessive thermal conductivity of the filler is not conducive to improving the thermal conductivity of the system. When the ratio of the thermal conductivity of the filler to the matrix resin exceeds 100, the improvement in the thermal conductivity of the composite material is not significant.

2.Particle size and geometry of thermally conductive fillers

When the amount of filler is the same, nanoparticles are more conducive to improving the thermal conductivity of the adhesive than microparticles. The quantum effect of nanoparticles increases the number of grain boundaries, thereby increasing the specific heat capacity and turning covalent bonds into metallic bonds. The heat conduction changes from molecular (or lattice) vibration to free electron heat transfer, so the thermal conductivity of nanoparticles is relatively higher. High; at the same time, the small size and large number of nanoparticles result in a large specific surface area, and it is easy to form an effective thermal conductive network in the matrix, so it is beneficial to improve the thermal conductivity of the adhesive. For micron particles, when the amount of filler is the same, the thermal conductive filler with large particle size has a smaller specific surface area and is not easily wrapped by the adhesive. Therefore, the probability of connecting to each other is greater (it is easier to form an effective thermal conductive path), which is conducive to improving the thermal conductivity of the adhesive. .

3.Hybrid filling of thermally conductive fillers

Compared with a filler filling system with a single particle size, mixed filling of the same filler with different particle sizes is more conducive to improving the thermal conductivity of the adhesive. Mixed filling of different forms of the same filler is easier to obtain an adhesive with high thermal conductivity than filling with a single spherical filler. When different types of fillers are properly proportioned, mixed filling is better than single type filler filling. This is attributed to the fact that the above-mentioned hybrid fillings are easier to form a close-packed structure, and the high aspect ratio particles can easily play a bridging role between spherical particles during hybrid filling, thereby reducing the contact thermal resistance, thereby making the system have a relatively higher thermal conductivity.