company news about Preparations for using thermally conductive potting glue

Thermal conductive potting glue is an indispensable material in the field of electronic manufacturing. Its correct use is crucial to ensure equipment performance and extend service life. Before using thermally conductive potting compound, sufficient preparation work is required. First, make sure the work area is clean and tidy to prevent dust and impurities from affecting the effectiveness of the potting glue. Secondly, according to the type of potting glue and process requirements, prepare the required tools such as mixers, gauges, syringes, and scrapers, as well as protective equipment such as gloves and masks. Finally, check whether the packaging of the potting glue is intact, confirm its model, production date, shelf life and other information to ensure that the quality of the potting glue meets the requirements.

Stir and mix

Thermal conductive potting glue usually consists of two parts: thermal conductive filler and adhesive, which need to be mixed in a certain proportion. Use a mixer to mix the thermally conductive filler and adhesive thoroughly to avoid uneven mixing. During the mixing process, pay attention to controlling the mixing speed and mixing time to avoid excessive bubbles.

Potting operation

Before potting, make sure the equipment surface is dry and free of oil and impurities. According to the equipment structure and potting requirements, select the appropriate potting method and tools. Control the speed and flow of the potting glue to avoid excessive bubbles and glue overflow during the potting process. During the potting process, pay attention to the flow and distribution of the potting glue to ensure that the potting glue can completely cover the areas that need to be sealed and thermally conductive.

Curing and post-processing

Follow the operating procedures and place the potted equipment under appropriate temperature and humidity conditions for curing. During the curing process, avoid moving or vibrating the equipment to avoid affecting the curing effect. After curing is completed, necessary inspections and tests are carried out on the equipment to ensure that the performance of the potting glue meets the requirements. If necessary, the equipment can be post-processed, such as polishing, cleaning, etc., to improve the appearance quality and performance of the equipment. The correct use of thermally conductive potting compound is the key to ensuring stable performance and extending service life of electronic components. By following the above detailed operating steps, you can effectively improve the use effect of thermally conductive potting glue, protect electronic components from external corrosion and contamination, and provide effective heat dissipation.